Laser Depaneling – If Contemplating FPC Punching Equipment, Then Read This Topic.

BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s numerous lasers are equipped to handle volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. It is the right strategy to use when you will find sharp corners or many tight radii of curvature in the PCB Router or in the flex circuit.

Dependant upon the material along with the part requirements, BEST laser services gives a tool-less part removal process as final perforation, scoring and hold-in tabs. By using a laser to execute the depaneling provides the user the main benefit of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost with out cutting oils or other contaminants.

rigid flex depanelizedIn addition BEST might be that provider of laser depanelization when you have plenty of IoT devices which must be precisely machined or eliminate to put perfectly directly into small mechanical enclosures.

As a result of contact-free processing that proceeds with PCB Laser Cutting Machine of printed circuit boards, there is very little distortion regardless if thin materials are employed. When boards are milled or punched out using a mechanical tool there could show to be a loss precision and potentially a distortion within the outside board dimensions. Worse yet it might crack solder joints when utilizing these mechanical means. In BEST laser depanelization system feature fiducial registration and web-based scaling, which implies already existing distortions could be compensated as well as the cut contours positioned precisely in the layout.

Similar to scoring or v-grooves, laser perforations are another choice for singulated board removal from a panel or sheet. Perforations might be laser formed to your size and spacing in order to meet the specified removal and securement forces.

Laser scoring can make a limited depth ablation line in the panelized boards. In most cases the depth in the score lines are 50% from the material thickness and may be controlled to a desired depth. The scoring acts inside a manner the same as the hold-tab to secure the part from the panel or sheet, but allows for individual 19dexjpky to be ‘snapped’ out after processing. Laser scoring lines could also be used like a deliberate path for crack propagation or stress relief. When performing the score lines being a service BEST can either use the IPC guidelines or follow customer requirements.

Hold-in tabs are small uncut sections throughout the board which are widely used to secure the PCB Punching in the panel. The hold-in tabs are used for ease of handling small boards or perhaps for printed circuit board securement for further processing. The hold-in tab width is chosen in line with the volume of force desired to get rid of the part in the panel/sheet or known forces being applied by downstream processes like component loading. BEST laser services can make tabs generally in most board materials as well as to nearly any width and location concerning the part.